MTE560I

Transcend's MTE560I M.2 SSD features a PCI Express (PCIe) Gen 4 x4 interface, 112 layers of 3D NAND flash and SLC mode technology, which delivers sustained high speeds and SLC-grade durability. Its integrated DRAM cache enables fast random read and write speeds and improves drive endurance. In addition, the 30 µ" gold finger PCB, Corner Bond technology and anti-sulfur resistors ensure reliability in harsh conditions. Transcend's MTE560I is also 100% in-chamber tested internally for wide operating temperatures of -40 ℃ ~ 85 ℃.

In addition, the MTE560I is a self-encrypting drive (SED) that complies with TCG (Trusted Computing Group) 2.0 standards. Data is protected by hardware-based 256-bit AES encryption and sector-specific LBA (logical block address) permissions.

112-layer 3D NAND Flash

Corner Bond

Extended Temperature

Dynamic Speed Limit Adjustment

Alteration in Reading Data

Anti-Sulfur Technology

Rubbish Collection

Wear levelling

TRIM

Faulty Block Management

Power Shield

Early Move

30 µ" PCB Gold Finger

AES encryption

TCG OPAL

SLC MODE

OVER PROVISIONING

Firmware features

  • Supports NVM commands
  • Dynamic thermal throttling
  • LDPC ECC (Error Correction Code) function Integrated
  • Advanced Global Wear Leveling and Defective Block Management for Reliability
  • Advanced Garbage Collection
  • Static Data Refresh
  • Enhanced S.M.A.R.T. function for durability
  • TRIM command for better performance
  • NCQ command for better performance
  • Encryption of entire disk with Advanced Encryption Standard (AES)
  • Compliant with TCG Opal specifications and IEEE 1667 standard

Hardware features

  • Complies with RoHS 2.0 standards
  • Compliant with NVM Express 1.4 specifications
  • Compliant with PCI Express 4.0 specifications
  • M.2 form factor (80mm) - ideal for mobile computing devices
  • PCIe Gen 4 x 4 interface
  • Integrated DDR4 cache module
  • High-quality 3D NAND Flash and SLC mode for exceptional durability and reliability
  • The main components are factory reinforced with Corner Bond technology.
  • PCB has 30µ thick gold connection pins
  • Implemented anti-sulfur technology to prevent sulfidation in the environment.
  • Power Shield (PS) to ensure data transfer integrity and minimise data corruption in the drive during an abnormal power outage
  • Promised operational reliability over a wide temperature range (from -40 ℃ to 85 ℃)
  • Supports Transcend's Scope Pro software

Specifications

Appearance

Dimensions 80.0 mm x 22.0 mm x 3.58 mm (3.15″ x 0.87″ x 0.14″)
Weight 9 g (0.32 oz)
Type M.2
  • 2280-D2-M (Double-sided)
Form Factor
  • M.2 2280

Interface

Bus Interface
  • NVMe PCIe Gen4 x4

Storage

Capacity
  • 80 GB/
  • 160 GB/
  • 320 GB/
  • 640 GB
Flash Type
  • 112-layer 3D NAND flash (SLC mode)

Operating Environment

Operating Voltage
  • 3.3V±5%
Operating Temperature
  • Wide temperature

    -40°C (-40°F) ~ 85°C (185°F)

Storage Temperature -55°C (-67°F) ~ 85°C (185°F)
Humidity 5% ~ 95%
Hit
  • 1500 G, 0.5 ms, 3 axes
Vibration (Operating) 20 G (Peak-to-Peak), 7 Hz ~ 2,000 Hz (frequency)

Feeding

Power consumption (Operating) 5 watt(s)
Energy consumption (IDLE) 1.25 watt(s)

Performance

Sequential Read / Write (CrystalDiskMark) Read: Up to 3,800 MB/s
Write: Up to 3,100 MB/s
4K Random Read / Write (IOmeter) Read: Up to 190,000 IOPS
Write: Up to 320,000 IOPS
Mean Time Between Failures (MTBF) 3,000,000 hour(s)
Terabytes Written (TBW) Up to 9,500 TBW
Number of Discs Written Per Day (DWPD) 54.2 (3 years)
Note
  • Speed may vary due to host, hardware, software, usage and storage capacity.
  • The workload used to rate DWPD may be different compared to your actual workload, due to the difference in hardware, software, usage and storage capacity of the host.
  • Terabytes Written (TBW) indicates the resistance under the highest capacity.

Warranty

Certificate
  • CE/
  • UKCA/
  • FCC/
  • BSMI
Warranty
  • Three-Year Limited Warranty
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Tempel Group
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